C-IS-0404S Модуль CIB, 4×AI/DI, 4×DO, PWM, H-мост

The C-IS-0404S module on the CIB Common Installation Bus® with 4x AI / DI and 4x DO and is built-in. It contains four binary outputs that can be used (in pairs DO1 with DO2 and DO3 with DO4) as 'H bridges' for controlled polarity reversal or as PWM outputs of the open collector type eg for control of model actuators (only with external power supply), or as common transistor outputs 24 VDC 50 mA. It contains four universal inputs configurable in pairs (DI / AI1 with DI / AI2 and DI / AI3 with DI / AI4) either as binary allowing connection of a potential-free contact against a common GND conductor or as analog for direct connection of passive resistance sensors Pt1000, Ni1000, NTC 12k , KTY 81-121 (measured resistance value is converted in the module directly to a numerical temperature value), or general resistance measurement in the range of 0–100 kΩ or DC voltage in the range of 0–2 V. The TXN 143 14 module is in a shrink tube and is equipped with terminal blocks with tongue terminals. The TXN 143 14.01 module is not protected by a tube or does not contain terminal blocks, all signals are routed to the socket strips, a built-in connection is assumed here by sliding the module onto the plugs of the expansion board.

DI
DI/AI	4x DI/AI
DO
AI
AO
COM
SENSOR

COM - System buses
CIB - Common Installation Bus (R): Installation I/O bus	1x CIB slave
DI - Organization of binary inputs
Total number of binary inputs	4
Number of groups of binary inputs	2
Organization of binary inputs into groups	2x (DI1, DO2) 2x (DI3, DI4)
DI - Parameters of binary inputs DC (group A)
Common wire	GND - module ground
Combined input type	DI/AI Active, for sensing potential-free contacts and measuring resistance sensors
Galvanic isolation of inputs from internal/peripheral circuits	No
Diagnostics	signaling of excited input in Mosaic
DO/RO - Organization of binary outputs
Total number of binary outputs	4
Number of binary output groups	2
DO - Parameters of binary transistor outputs (group A)
Parameters valid for the terminals	DO1 - DO4
Number of transistor outputs	4
Number of output groups	2
Number of outputs in group	2
Organization of transistor outputs into groups	2x (DO1, DO2) 2x (DO3, DO4)
Switching voltage	20 V DC
Switching current, output load	40 mA max. (sum of currents of all DO)
Short circuit protection	Yes
Special functions (A)	PWM
Operating frequency	50 Hz max.
Alternation settings	0 – 100 %
AI - Organization of analog inputs
Total number of analog inputs	4
Number of analog input groups	2
Organization of analog inputs into groups	2x AI (AI1, AI2) 2x AI (AI3, AI4)
Common wire	GND terminal
Galvanic separation from internal circuits	No
Converter type	Approximation
Operating modes	periodic input sensing
Analog input error - Temperature coefficient	± 0,1% of full scale/K
Analog input error - Nonlinearity	± 0,1% of full scale
Analog input error - Steady state repeatability	± 0,5% of full scale
AI - Analog Input Ranges (Group A)
Parameters valid for inputs on the terminals	AI1 - AI4
Voltage	0 to 2 V / 805.9 μV
Voltage input error - max. error at 25 ° C	± 2.0% of full scale
Voltage input error - temperature coefficient	± 0,05% of full scale/K
Voltage input error - non-linearity	± 0.1% of full scale
Voltage input error - repeatability under steady state conditions	0.5% of full scale
Passive sensor	NTC Thermistor 12k / 25 °C (-40 to + 125 °C)
DI: Voltage-free contact	0 when> 1.5 kOhm, 1 when <0.5 kOhm
DI: Balanced resistance input	2x 1k1 (tamper/0/1/tamper)
Resistance measurement error - maximum error at 25 ° C	± 0.5% of full scale
Resistance measurement error - temperature coefficient	± 0.05% of full scale / K
Resistance measurement error - non-linearity	± 0.09% of full scale
Resistance measurement error - repeatability at steady conditions	0.07% of full scale
Power supply
Nominal supply voltage (V)	24 V DC
Power supply from CIB - typical current consumption (mA)	50 mA
Power supply from CIB - maximum current consumption (mA)	60 mA
Galvanic separation of power supply from internal circuits	No
Size and weight
Weight approx.	50 g
Module width	80 mm
Module height	40 mm
Module depth	15 mm
Product dimensions (width x height x depth)	80 x 40 x 15 mm
Operating conditions, product standards
Product standard	ČSN EN 60730-1 ed.4 :2017 (EN 60730-1:2016) -Automatic electronic control device (for household and similar purposes)
Protection class of electrical object	II, according to ČSN EN 61140 ed.3: 2016 (idt IEC 61140:2016)
IP rating (Ingress Protection) according to ČSN EN 60529: 1993 (idt IEC 529: 1989)	IP10
Operating areas	Normal, acc. ČSN 33 2000-1 ed.2: 2009 (mod IEC 60354-1:2005)
Degree of pollution	2, according to ČSN EN 60664-1 ed.2: 2008 (idt IEC 60664-1: 2007)
Overvoltage category installation	III, according to EN 60664-1 ed_2: 2008 (idt IEC 60641-1: 2007)
Type of device	In the installation box, under the cover
Working position	Any
Type of operation (operating frequency)	Continuous
Ambient operating temperatures	-20 °C to + 55 °C
Operating temperature maximum (° C)	+55°C
Operating temperature minimum (° C)	-20°C
Operating relative humidity	from 10 % up to 95 % without condensation
Operating atmospheric pressure	min. 70 kPa (<3,000 m above sea level)
Storage temperatures	–25 °C to +70 °C
Electromagnetic compatibility, Mechanical endurance
Electromagnetic compatibility / Emission	A, according to EN 55032 ed. 2: 2017 (idt CISPR 32: 2015)
Electromagnetic compatibility / Immunity	min. according to ČSN EN 60730-1 ed.3: 2012
Sinusoidal vibration endurance	10 Hz to 57 Hz, amplitude 0,075 mm, 57 Hz to 150 Hz, acceleration 1 G (Fc test according to EN 60068-2-6: 1997 (idt IEC 68-2-6: 1995), 10 cycles per axis.)
Installation
Attention!	The modules contain components sensitive to electrostatic charge, so we observe them principles for working with these circuits! We handle only on the module disconnected from the power supply! When replacing the submodules, the correctness of the deployment must be carefully checked of the submodule cavities against the tips on the motherboard. The tubes have no coding position and incorrect installation, may occur when the power is turned on again damage to the submodule or even the motherboard !!!
Connection
Cross-section of connected wires fixed (min)	0,14 mm2
Cross-section of connected wires fixed (max)	0,5 mm2
Cross-section of connected wires stranded (min)	0,14 mm2
Cross-section of connected wires stranded (max)	0,25 mm2
Module operation
Module configuration	The module is operated, set up and diagnosed from the Mosaic development environment.
Module diagnostics	The basic diagnostic system of the module is a part of its standard software. It operates from module power on and operates independently of the user. Diagnostic error states of the module and connected peripheral modules of the assembly are signaled
Maintenance
Description	The module does not require any maintenance under general installation conditions.
Notice	Because the module contains semiconductor components, it is necessary to follow the principles for working with electrostatic sensitive components when handling the removed cover. It is not allowed to directly touch the printed circuit boards without protective measures !!!
Warranty
Generally	Warranty and complaint conditions are governed by the Terms and Conditions of Teco a.s.
Notice	You must meet all the conditions of this documentation before turning on the system. The system must not be put into service unless it has been verified and confirmed that the machinery meets the requirements of Directive 89/392 / EEC, in so far as it applies to it. Documentation subject to change.